Pumpkin Spice Muffins
Submitted by nissyta
Pumpkin spice muffins with a cinnamon streusel topping, made quick with biscuit baking mix. Warm spices of nutmeg, ginger, and cinnamon in every tender bite.
YIELD
1 dozenPREP
15 minCOOK
15 minREADY
30 minThese pumpkin spice muffins come together fast thanks to biscuit baking mix, which handles the flour, leavening, and salt in one scoop. The batter takes minutes to stir together, and the cinnamon streusel on top bakes into a crumbly, sugary crust that cracks when you break a warm muffin open.
The triple hit of cinnamon, nutmeg, and ginger gives these a warm spice profile without any one flavor dominating. Canned pumpkin puree keeps them moist and adds that earthy sweetness. Stir the batter just until the dry ingredients are moistened. Overmixing develops the gluten in the baking mix and turns the muffins tough and dense instead of tender.
The streusel is dead simple: a little more baking mix, sugar, cinnamon, and butter pinched together with your fingers until crumbly. Sprinkle it on before baking and let the oven do the rest.
Chef Tips
- Don’t overmix: A few lumps in the batter are fine. Smooth batter means overworked gluten and rubbery muffins.
- Use pure pumpkin puree, not pumpkin pie filling. Pie filling already has sugar and spices added, which will throw off the balance.
- Fill cups ⅔ full: Overfilling means the muffins spread sideways instead of doming up.
- Test early: Check at 13 minutes. These bake quickly and overbaking dries out the pumpkin.
Variations
- Cream cheese center: Press a small cube of cream cheese into the middle of each muffin before baking for a tangy surprise.
- Chocolate chip pumpkin: Fold a handful of mini chocolate chips into the batter.
Ingredients
Directions
In a mixing bowl, combine pumpkin, milk and egg with a fork. Combine dry ingredients; add to mixing bowl and stir just until moistened.
Spoon into 12 well greased muffin cups.
Combine streusel ingredients; sprinkle over muffins.
Bake at 400℉ (200℃) for 15 minutes or until golden brown.
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